Thermal conduction pad - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Thermal conduction pad Product List

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Thermal Conductive Pad "HT-11A"

It has a high thermal conductivity and exhibits excellent heat dissipation! Suitable for low-pressure environments.

The "HT-11A" is a high thermal conductivity pad with a thermal conductivity of 13W/m·K. It has a high thermal conductivity and exhibits excellent heat dissipation effects. It is suitable for low-pressure environments, has adhesive properties, and adheres to the target object. This is a model change of "HT-11." There are no differences. Since it does not have adhesive strength, please use it in environments where heat sinks are fixed with pins or screws. 【Specifications】 ■ Manufactured by GlacialTech Inc. TCP130 ■ Thermal conductivity: 13W/m·K ■ Size: W40×D40×H0.5mm ■ Compliant with RoHS Directive (10 substances) *For more details, please refer to the related links or feel free to contact us.

Company：アイネックス
Price：Other

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Thermal Conductive Pad "HT-22"

Three large sheets included! Easily usable for multiple sheets, height adjustment, reinstallation of heat sinks, etc.

The "HT-22" is a general-purpose thermal conductive pad used between a heating element and a heat sink. Due to its soft material, it can be cut with scissors to accommodate various sizes. It can also be used for larger heating elements. This is a cost-effective package containing three large sheets measuring 10cm square. It is ideal for upgrading or replacing the original pads of M.2 SSDs, memory, and motherboards. Its flexibility and elasticity make it suitable for filling uneven surfaces. 【Specifications (partial)】 ■ Thermal conductivity: 3W/m·K ■ Operating temperature: -40 to 150℃ ■ Flame retardancy: UL94 V-0 ■ Dielectric breakdown voltage: >6kV/mm ■ Size: W100×D100×H0.6mm *For more details, please refer to the related links or feel free to contact us.

Company：アイネックス
Price：Other

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High-performance thermal conductive pad 'TGF-P1'

Cut the width in half to create pads for two M.2 SSDs!

"TGF-P1" is a high-performance thermal conductive pad with a thermal conductivity of 15.6W/m·K. By incorporating nanomaterials, it achieves a maximum thermal conductivity of 15.6W/m·K. It is easy to cut to any size, simple to handle, and can be used for M.2 SSDs, graphics cards, RAM, laptops, and more. It excels in flexibility, making it suitable for filling gaps between various components. It operates stably within a temperature range of -40°C to 200°C, accommodating a wide range of applications. It is insulating, non-conductive, environmentally friendly, and non-toxic. 【Specifications (partial)】 ■ Thermal conductivity: 15.6W/m·K ■ Specific gravity: 3.4g/cm3 ■ Hardness: 30–55Sc ■ Operating temperature: -40–200°C ■ Flame retardancy: UL94 V-0 *For more details, please refer to the related links or feel free to contact us.